Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.
Xiao Y, Wang Q, Wang L, Zeng X, Li M, Wang Z, Zhang X, Zhu X.
Xiao Y, et al. Among authors: wang l, wang z, wang q.
Ultrason Sonochem. 2018 Jul;45:223-230. doi: 10.1016/j.ultsonch.2018.03.005. Epub 2018 Mar 16.
Ultrason Sonochem. 2018.
PMID: 29705316
Free article.