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Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates.
Micromachines (Basel). 2023 Feb 10;14(2):415. doi: 10.3390/mi14020415.
Micromachines (Basel). 2023.
PMID: 36838115
Free PMC article.
Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.
Hofmann C, Satwara M, Kroll M, Panhale S, Rochala P, Wiemer M, Hiller K, Kuhn H.
Hofmann C, et al. Among authors: satwara m.
Micromachines (Basel). 2022 Aug 12;13(8):1307. doi: 10.3390/mi13081307.
Micromachines (Basel). 2022.
PMID: 36014229
Free PMC article.
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