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Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.
Micromachines (Basel). 2022 Aug 12;13(8):1307. doi: 10.3390/mi13081307.
Micromachines (Basel). 2022.
PMID: 36014229
Free PMC article.
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates.
Selbmann F, Paul SD, Satwara M, Roscher F, Wiemer M, Kuhn H, Joseph Y.
Selbmann F, et al. Among authors: satwara m.
Micromachines (Basel). 2023 Feb 10;14(2):415. doi: 10.3390/mi14020415.
Micromachines (Basel). 2023.
PMID: 36838115
Free PMC article.
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