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Park GK, Park GJ, Park JJ, Lee N, Kim SW.Park GK, et al. Among authors: lee n.Materials (Basel). 2021 Mar 25;14(7):1608. doi: 10.3390/ma14071608.Materials (Basel). 2021.PMID: 33806124Free PMC article.
Lee N, Kim S, Park G.Lee N, et al.Materials (Basel). 2019 Oct 31;12(21):3591. doi: 10.3390/ma12213591.Materials (Basel). 2019.PMID: 31683748Free PMC article.
Lee N, Park G, Pae J, Moon J, Kim S.Lee N, et al.Materials (Basel). 2020 Nov 13;13(22):5125. doi: 10.3390/ma13225125.Materials (Basel). 2020.PMID: 33202917Free PMC article.
Cho K, Jo S, Noh YH, Lee N, Kim S, Yook JG.Cho K, et al. Among authors: lee n.Sensors (Basel). 2021 Nov 23;21(23):7789. doi: 10.3390/s21237789.Sensors (Basel). 2021.PMID: 34883792Free PMC article.
Park S, Lee N, An GH, Koh KT, Ryu GS.Park S, et al. Among authors: lee n.Materials (Basel). 2021 Nov 30;14(23):7333. doi: 10.3390/ma14237333.Materials (Basel). 2021.PMID: 34885487Free PMC article.
Park S, Park JK, Lee N, Kim MO.Park S, et al. Among authors: lee n.Materials (Basel). 2021 Mar 4;14(5):1210. doi: 10.3390/ma14051210.Materials (Basel). 2021.PMID: 33806644Free PMC article.
Park GS, Ho DH, Lyu B, Jeon S, Ryu DY, Kim DW, Lee N, Kim S, Song YJ, Jo SB, Cho JH.Park GS, et al. Among authors: lee n.Sci Adv. 2022 Apr;8(13):eabl5299. doi: 10.1126/sciadv.abl5299. Epub 2022 Mar 30.Sci Adv. 2022.PMID: 35353563Free PMC article.
Makihara T, Lee N, Guo Y, Guan W, Safavi-Naeini A.Makihara T, et al. Among authors: lee n.Nat Commun. 2024 May 31;15(1):4640. doi: 10.1038/s41467-024-48975-x.Nat Commun. 2024.PMID: 38821933Free PMC article.
Park SJ, Kweon S, Moyo MK, Kim HR, Choi JU, Lee NK, Maharjan R, Cho YS, Park JW, Byun Y.Park SJ, et al. Among authors: lee nk.Biomaterials. 2024 May 25;310:122625. doi: 10.1016/j.biomaterials.2024.122625. Online ahead of print.Biomaterials. 2024.PMID: 38820768
Kim TY, Kang M, Shim HJ, Kang OK, Huh HJ, Lee NY.Kim TY, et al. Among authors: lee ny.J Clin Lab Anal. 2024 May;38(9):e25043. doi: 10.1002/jcla.25043. Epub 2024 May 28.J Clin Lab Anal. 2024.PMID: 38804639Free PMC article.