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shi qin wan
(1 results)?
Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si3N4 Nanowires.
ACS Appl Mater Interfaces. 2023 Jul 12;15(27):32885-32894. doi: 10.1021/acsami.3c04473. Epub 2023 Jul 1.
ACS Appl Mater Interfaces. 2023.
PMID: 37392172
Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons.
Hao X, Wan S, Zhao Z, Zhu L, Peng D, Yue M, Kuang J, Cao W, Liu G, Wang Q.
Hao X, et al. Among authors: wan s.
ACS Appl Mater Interfaces. 2023 Jan 11;15(1):2124-2133. doi: 10.1021/acsami.2c18356. Epub 2022 Dec 28.
ACS Appl Mater Interfaces. 2023.
PMID: 36576869
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Oriented Three-Dimensional Skeletons Assembled by Si3N4 Nanowires/AlN Particles as Fillers for Improving Thermal Conductivity of Epoxy Composites.
Wang B, Wan S, Niu M, Li M, Yu C, Zhao Z, Xuan W, Yue M, Cao W, Wang Q.
Wang B, et al. Among authors: wan s.
Polymers (Basel). 2023 Nov 16;15(22):4429. doi: 10.3390/polym15224429.
Polymers (Basel). 2023.
PMID: 38006153
Free PMC article.
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