Cheolgyu Kim - Search Results

Year	Number of Results
2016	3
2017	1
2018	2
2019	2
2020	1
2021	1
2022	2
2024	0

1

A Study on the Healing Performance of Mortar with Microcapsules Using Silicate-Based Inorganic Materials.

Kim CG, Choi YW, Choi S, Oh SR. Kim CG, et al. Materials (Basel). 2022 Dec 13;15(24):8907. doi: 10.3390/ma15248907. Materials (Basel). 2022. PMID: 36556725 Free PMC article.

2

Somatosensory actuator based on stretchable conductive photothermally responsive hydrogel.

Zhao Y, Lo CY, Ruan L, Pi CH, Kim C, Alsaid Y, Frenkel I, Rico R, Tsao TC, He X. Zhao Y, et al. Among authors: kim c. Sci Robot. 2021 Apr 7;6(53):eabd5483. doi: 10.1126/scirobotics.abd5483. Sci Robot. 2021. PMID: 34043561

3

Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality.

Han Y, Han HJ, Rah Y, Kim C, Kim M, Lim H, Ahn KH, Jang H, Yu K, Kim TS, Cho EN, Jung YS. Han Y, et al. Among authors: kim c. Adv Mater. 2020 Sep;32(38):e2002099. doi: 10.1002/adma.202002099. Epub 2020 Aug 16. Adv Mater. 2020. PMID: 33617118

4

Visualizing Morphogenesis through Instability Formation in 4-D Printing.

Wu D, Song J, Zhai Z, Hua M, Kim C, Frenkel I, Jiang H, He X. Wu D, et al. Among authors: kim c. ACS Appl Mater Interfaces. 2019 Dec 18;11(50):47468-47475. doi: 10.1021/acsami.9b19730. Epub 2019 Dec 4. ACS Appl Mater Interfaces. 2019. PMID: 31741387

5

Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips.

Oh MS, Song YS, Kim C, Kim J, You JB, Kim TS, Lee CS, Im SG. Oh MS, et al. Among authors: kim c. ACS Appl Mater Interfaces. 2016 Apr 6;8(13):8782-8. doi: 10.1021/acsami.5b12704. Epub 2016 Mar 24. ACS Appl Mater Interfaces. 2016. PMID: 26974225

6

An Experimental Study on the Healing Performance of Complex Capsules Using Multiphase Inorganic Materials for Crack Self-Healing of Cement Mortars.

Choi YW, Kim CG, Nam EJ, Oh SR. Choi YW, et al. Materials (Basel). 2022 Dec 9;15(24):8819. doi: 10.3390/ma15248819. Materials (Basel). 2022. PMID: 36556625 Free PMC article.

7

Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit.

Kim S, Kim C, Bong JH, Hwang WS, Kim TS, Oh JS, Cho BJ. Kim S, et al. Among authors: kim c. J Nanosci Nanotechnol. 2019 Oct 1;19(10):6473-6480. doi: 10.1166/jnn.2019.17066. J Nanosci Nanotechnol. 2019. PMID: 31026980

8

Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings.

Park JH, Seo J, Kim C, Joe DJ, Lee HE, Im TH, Seok JY, Jeong CK, Ma BS, Park HK, Kim TS, Lee KJ. Park JH, et al. Among authors: kim c. Adv Sci (Weinh). 2018 Oct 4;5(11):1801146. doi: 10.1002/advs.201801146. eCollection 2018 Nov. Adv Sci (Weinh). 2018. PMID: 30479937 Free PMC article.

9

A three-dimensional metal grid mesh as a practical alternative to ITO.

Jang S, Jung WB, Kim C, Won P, Lee SG, Cho KM, Jin ML, An CJ, Jeon HJ, Ko SH, Kim TS, Jung HT. Jang S, et al. Among authors: kim c. Nanoscale. 2016 Aug 7;8(29):14257-63. doi: 10.1039/c6nr03060b. Epub 2016 Jul 12. Nanoscale. 2016. PMID: 27404907

10

Correction: A three-dimensional metal grid mesh as a practical alternative to ITO.

Jang S, Jung WB, Kim C, Won P, Lee SG, Cho KM, Jin ML, An CJ, Jeon HJ, Ko SH, Kim TS, Jung HT. Jang S, et al. Among authors: kim c. Nanoscale. 2018 Sep 20;10(36):17410. doi: 10.1039/c8nr90191k. Nanoscale. 2018. PMID: 30198036

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