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Influence of varying porogen loads and different UV cures on low-kappa film characteristics.
J Nanosci Nanotechnol. 2011 Sep;11(9):8363-7. doi: 10.1166/jnn.2011.5033.
J Nanosci Nanotechnol. 2011.
PMID: 22097585
A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers.
Goethals F, Baklanov MR, Ciofi I, Detavernier C, Van der Voort P, Van Driessche I.
Goethals F, et al. Among authors: ciofi i.
Chem Commun (Camb). 2012 Mar 14;48(22):2797-9. doi: 10.1039/c2cc18017k. Epub 2012 Jan 30.
Chem Commun (Camb). 2012.
PMID: 22286331
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Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.
Wen LG, Roussel P, Pedreira OV, Briggs B, Groven B, Dutta S, Popovici MI, Heylen N, Ciofi I, Vanstreels K, Østerberg FW, Hansen O, Petersen DH, Opsomer K, Detavernie C, Wilson CJ, Elshocht SV, Croes K, Bömmels J, Tőkei Z, Adelmann C.
Wen LG, et al. Among authors: ciofi i.
ACS Appl Mater Interfaces. 2016 Oct 5;8(39):26119-26125. doi: 10.1021/acsami.6b07181. Epub 2016 Sep 21.
ACS Appl Mater Interfaces. 2016.
PMID: 27598509
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