A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

Frederik Goethals; Mikhail R Baklanov; Ivan Ciofi; Christophe Detavernier; Pascal Van der Voort; Isabel Van Driessche

doi:10.1039/c2cc18017k

A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

Chem Commun (Camb). 2012 Mar 14;48(22):2797-9. doi: 10.1039/c2cc18017k. Epub 2012 Jan 30.

Authors

Frederik Goethals¹, Mikhail R Baklanov, Ivan Ciofi, Christophe Detavernier, Pascal Van der Voort, Isabel Van Driessche

Affiliation

¹ Department of Inorganic and Physical Chemistry, Ghent University, Krijgslaan 281, building S3, 9000 Ghent, Belgium.

PMID: 22286331
DOI: 10.1039/c2cc18017k

Abstract

A new strategy to seal mesoporous low-k thin films with a pore size of 3 nm has been developed. This is achieved by spin-coating of a self-assembled carbon-bridged organosilica layer followed by a grafting with hexamethyl disilazane.