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Hybrid Printing for the Fabrication of Smart Sensors.
J Vis Exp. 2019 Jan 31;(143). doi: 10.3791/58677.
J Vis Exp. 2019.
PMID: 30774128
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker KF, Rzepka S, Schneider-Ramelow M.
Roshanghias A, et al. Among authors: zikulnig j.
Micromachines (Basel). 2020 May 31;11(6):564. doi: 10.3390/mi11060564.
Micromachines (Basel). 2020.
PMID: 32486457
Free PMC article.
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Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw's Method.
Zikulnig J, Roshanghias A, Rauter L, Hirschl C.
Zikulnig J, et al.
Sensors (Basel). 2020 Apr 23;20(8):2398. doi: 10.3390/s20082398.
Sensors (Basel). 2020.
PMID: 32340200
Free PMC article.
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Future Thread: Printing Electronics on Fibers.
Jose M, Bezerra Alexandre E, Neumaier L, Rauter L, Vijjapu MT, Muehleisen W, Malik MH, Zikulnig J, Kosel J.
Jose M, et al. Among authors: zikulnig j.
ACS Appl Mater Interfaces. 2024 Feb 14;16(6):7996-8005. doi: 10.1021/acsami.3c15422. Epub 2024 Feb 4.
ACS Appl Mater Interfaces. 2024.
PMID: 38310570
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