A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging.
Wang J, Wang X, Zhang L, Zhang L, Duan F, Wang F, Zhang W, Wang J, Zhang Z, Hang C, Chen H.
Wang J, et al. Among authors: zhang l, zhang w, zhang z.
Materials (Basel). 2022 Jan 25;15(3):914. doi: 10.3390/ma15030914.
Materials (Basel). 2022.
PMID: 35160861
Free PMC article.