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Crack propagation and fracture in silicon wafers under thermal stress.
J Appl Crystallogr. 2013 Aug 1;46(Pt 4):849-855. doi: 10.1107/S0021889813003695. Epub 2013 Jun 7.
J Appl Crystallogr. 2013.
PMID: 24046487
Free PMC article.
Local strain and defects in silicon wafers due to nanoindentation revealed by full-field X-ray microdiffraction imaging.
Li ZJ, Danilewsky AN, Helfen L, Mikulik P, Haenschke D, Wittge J, Allen D, McNally P, Baumbach T.
Li ZJ, et al. Among authors: wittge j.
J Synchrotron Radiat. 2015 Jul;22(4):1083-90. doi: 10.1107/S1600577515009650. Epub 2015 Jun 26.
J Synchrotron Radiat. 2015.
PMID: 26134815
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