Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding.
Wang Z, He C, Zhang W, Li Y, Gao P, Meng Y, Zhang G, Yang Y, Wang R, Cui J, Wang H, Zhang B, Ren Y, Zhen G, Jiao X, Zhang S.
Wang Z, et al. Among authors: wang h, wang r.
Micromachines (Basel). 2022 Jan 8;13(1):99. doi: 10.3390/mi13010099.
Micromachines (Basel). 2022.
PMID: 35056263
Free PMC article.