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Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling.
Materials (Basel). 2017 Apr 26;10(5):451. doi: 10.3390/ma10050451.
Materials (Basel). 2017.
PMID: 28772811
Free PMC article.
Atomistic analysis of the thermomechanical properties of Sn-Ag-Cu solder materials at the nanoscale with the MEAM potential.
Motalab M, Paul R, Saha S, Mojumder S, Ahmed T, Suhling JC.
Motalab M, et al. Among authors: suhling jc.
J Mol Model. 2019 Feb 11;25(3):59. doi: 10.1007/s00894-019-3939-1.
J Mol Model. 2019.
PMID: 30741336
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