Spolenak R - Search Results

1

Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

Menétrey M, van Nisselroy C, Xu M, Hengsteler J, Spolenak R, Zambelli T. Menétrey M, et al. Among authors: spolenak r. RSC Adv. 2023 May 3;13(20):13575-13585. doi: 10.1039/d3ra00611e. eCollection 2023 May 2. RSC Adv. 2023. PMID: 37152573 Free PMC article.

2

Scanning X-ray strain microscopy of inhomogeneously strained Ge micro-bridges.

Etzelstorfer T, Süess MJ, Schiefler GL, Jacques VL, Carbone D, Chrastina D, Isella G, Spolenak R, Stangl J, Sigg H, Diaz A. Etzelstorfer T, et al. Among authors: spolenak r. J Synchrotron Radiat. 2014 Jan;21(Pt 1):111-8. doi: 10.1107/S1600577513025459. Epub 2013 Nov 2. J Synchrotron Radiat. 2014. PMID: 24365924 Free PMC article.

3

Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition.

Hirt L, Ihle S, Pan Z, Dorwling-Carter L, Reiser A, Wheeler JM, Spolenak R, Vörös J, Zambelli T. Hirt L, et al. Among authors: spolenak r. Adv Mater. 2016 Mar 23;28(12):2311-5. doi: 10.1002/adma.201504967. Epub 2016 Jan 19. Adv Mater. 2016. PMID: 26783090

4

Additive Manufacturing of Metal Structures at the Micrometer Scale.

Hirt L, Reiser A, Spolenak R, Zambelli T. Hirt L, et al. Among authors: spolenak r. Adv Mater. 2017 May;29(17). doi: 10.1002/adma.201604211. Epub 2017 Jan 4. Adv Mater. 2017. PMID: 28052421 Review.

5

Thermal Management in Ni/Al Reactive Multilayers: Understanding and Preventing Reaction Quenching on Thin Film Heat Sinks.

Danzi S, Menétrey M, Wohlwend J, Spolenak R. Danzi S, et al. Among authors: spolenak r. ACS Appl Mater Interfaces. 2019 Nov 13;11(45):42479-42485. doi: 10.1021/acsami.9b14660. Epub 2019 Nov 4. ACS Appl Mater Interfaces. 2019. PMID: 31682402

6

Metals by Micro-Scale Additive Manufacturing: Comparison of Microstructure and Mechanical Properties.

Reiser A, Koch L, Dunn KA, Matsuura T, Iwata F, Fogel O, Kotler Z, Zhou N, Charipar K, Piqué A, Rohner P, Poulikakos D, Lee S, Seol SK, Utke I, van Nisselroy C, Zambelli T, Wheeler JM, Spolenak R. Reiser A, et al. Among authors: spolenak r. Adv Funct Mater. 2020 Jul 9;30(28):1910491. doi: 10.1002/adfm.201910491. Epub 2020 May 25. Adv Funct Mater. 2020. PMID: 32684902 Free PMC article.

7

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing.

Menétrey M, Koch L, Sologubenko A, Gerstl S, Spolenak R, Reiser A. Menétrey M, et al. Among authors: spolenak r. Small. 2022 Dec;18(51):e2205302. doi: 10.1002/smll.202205302. Epub 2022 Nov 3. Small. 2022. PMID: 36328737

8

Ice-Templated W-Cu Composites with High Anisotropy.

Röthlisberger A, Häberli S, Krogh F, Galinski H, Dunand DC, Spolenak R. Röthlisberger A, et al. Among authors: spolenak r. Sci Rep. 2019 Jan 24;9(1):476. doi: 10.1038/s41598-018-36604-9. Sci Rep. 2019. PMID: 30679526 Free PMC article.

9

Multi-metal electrohydrodynamic redox 3D printing at the submicron scale.

Reiser A, Lindén M, Rohner P, Marchand A, Galinski H, Sologubenko AS, Wheeler JM, Zenobi R, Poulikakos D, Spolenak R. Reiser A, et al. Among authors: spolenak r. Nat Commun. 2019 Apr 23;10(1):1853. doi: 10.1038/s41467-019-09827-1. Nat Commun. 2019. PMID: 31015443 Free PMC article.

10

Confined pulsed diffuse layer charging for nanoscale electrodeposition with an STM.

Aarts M, Reiser A, Spolenak R, Alarcon-Llado E. Aarts M, et al. Among authors: spolenak r. Nanoscale Adv. 2022 Jan 13;4(4):1182-1190. doi: 10.1039/d1na00779c. eCollection 2022 Feb 15. Nanoscale Adv. 2022. PMID: 35308601 Free PMC article.

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