Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems.
Truong TA, Nguyen TK, Zhao H, Nguyen NK, Dinh T, Park Y, Nguyen T, Yamauchi Y, Nguyen NT, Phan HP.
Truong TA, et al. Among authors: nguyen nk, nguyen nt, nguyen tk, nguyen t.
Small. 2022 Jan;18(4):e2105748. doi: 10.1002/smll.202105748. Epub 2021 Dec 7.
Small. 2022.
PMID: 34874620
Review.