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2022 6
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Database Development of SiO2 Etching with Fluorocarbon Plasmas Diluted with Various Noble Gases of Ar, Kr, and Xe.
Lee Y, Yeom H, Choi D, Kim S, Lee J, Kim J, Lee H, You S. Lee Y, et al. Nanomaterials (Basel). 2022 Oct 29;12(21):3828. doi: 10.3390/nano12213828. Nanomaterials (Basel). 2022. PMID: 36364604 Free PMC article.
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO(2) etching, with Ar typically employed in the dilution of the FC plasma due to its cost effectiveness and accessibility. ...The results of this work are expected to offer a practical etching data …
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO(2) etching, with Ar typically employed in the dilution …
Influence of Additive N2 on O2 Plasma Ashing Process in Inductively Coupled Plasma.
You YB, Lee YS, Kim SJ, Cho CH, Seong IH, Jeong WN, Choi MS, You SJ. You YB, et al. Nanomaterials (Basel). 2022 Oct 27;12(21):3798. doi: 10.3390/nano12213798. Nanomaterials (Basel). 2022. PMID: 36364574 Free PMC article.
One of the cleaning processes in semiconductor fabrication is the ashing process using oxygen plasma, which has been normally used N(2) gas as additive gas to increase the ashing rate, and it is known that the ashing rate is strongly related to the concentration of oxygen …
One of the cleaning processes in semiconductor fabrication is the ashing process using oxygen plasma, which has been normally used N( …
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.
Lee Y, You Y, Cho C, Kim S, Lee J, Kim M, Lee H, You Y, Kim K, You S. Lee Y, et al. Micromachines (Basel). 2022 Oct 29;13(11):1856. doi: 10.3390/mi13111856. Micromachines (Basel). 2022. PMID: 36363877 Free PMC article.
Direct wafer bonding is one of the most attractive techniques for next-generation semiconductor devices, and plasma has been playing an indispensable role in the wider adoption of the wafer bonding technique by lowering its process temperature. ...The results …
Direct wafer bonding is one of the most attractive techniques for next-generation semiconductor devices, and plasma has …
Low-Temperature Plasma Diagnostics to Investigate the Process Window Shift in Plasma Etching of SiO2.
Lee Y, Kim S, Lee J, Cho C, Seong I, You S. Lee Y, et al. Sensors (Basel). 2022 Aug 12;22(16):6029. doi: 10.3390/s22166029. Sensors (Basel). 2022. PMID: 36015787 Free PMC article.
As low-temperature plasma plays an important role in semiconductor manufacturing, plasma diagnostics have been widely employed to understand changes in plasma according to external control parameters, which has led to the achievement of appropriate plasma conditions normal …
As low-temperature plasma plays an important role in semiconductor manufacturing, plasma diagnostics have been widely employed to und …