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Highly sensitive p-type 4H-SiC van der Pauw sensor.
RSC Adv. 2018 Jan 15;8(6):3009-3013. doi: 10.1039/c7ra11922d. eCollection 2018 Jan 12.
RSC Adv. 2018.
PMID: 35541213
Free PMC article.
A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding.
Md Foisal AR, Phan HP, Dinh T, Nguyen TK, Nguyen NT, Dao DV.
Md Foisal AR, et al.
RSC Adv. 2018 Apr 24;8(28):15310-15314. doi: 10.1039/c8ra00734a. eCollection 2018 Apr 23.
RSC Adv. 2018.
PMID: 35539501
Free PMC article.
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Pushing the Limits of Piezoresistive Effect by Optomechanical Coupling in 3C-SiC/Si Heterostructure.
Md Foisal AR, Qamar A, Phan HP, Dinh T, Tuan KN, Tanner P, Streed EW, Dao DV.
Md Foisal AR, et al.
ACS Appl Mater Interfaces. 2017 Nov 22;9(46):39921-39925. doi: 10.1021/acsami.7b12128. Epub 2017 Nov 7.
ACS Appl Mater Interfaces. 2017.
PMID: 29098850
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Piezoresistive Effect with a Gauge Factor of 18 000 in a Semiconductor Heterojunction Modulated by Bonded Light-Emitting Diodes.
Nguyen T, Dinh T, Dau VT, Md Foisal AR, Guzman P, Nguyen H, Pham TA, Nguyen TK, Phan HP, Nguyen NT, Dao DV.
Nguyen T, et al. Among authors: md foisal ar.
ACS Appl Mater Interfaces. 2021 Jul 28;13(29):35046-35053. doi: 10.1021/acsami.1c05985. Epub 2021 Jul 8.
ACS Appl Mater Interfaces. 2021.
PMID: 34236166
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