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2019 | 1 |
2020 | 1 |
2024 | 0 |
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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Micromachines (Basel). 2020 May 31;11(6):564. doi: 10.3390/mi11060564.
Micromachines (Basel). 2020.
PMID: 32486457
Free PMC article.
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
Braun T, Becker KF, Hoelck O, Voges S, Kahle R, Dreissigacker M, Schneider-Ramelow M.
Braun T, et al. Among authors: dreissigacker m.
Micromachines (Basel). 2019 May 23;10(5):342. doi: 10.3390/mi10050342.
Micromachines (Basel). 2019.
PMID: 31126083
Free PMC article.
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