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Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects.
Materials (Basel). 2016 May 31;9(6):430. doi: 10.3390/ma9060430.
Materials (Basel). 2016.
PMID: 28773552
Free PMC article.
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods.
Jin Z, Shen YA, Zuo Y, Chan YC, Mannan SH, Nishikawa H.
Jin Z, et al. Among authors: mannan sh.
Sci Rep. 2021 Apr 21;11(1):8668. doi: 10.1038/s41598-021-88122-w.
Sci Rep. 2021.
PMID: 33883649
Free PMC article.
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Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration.
Mansourian A, Paknejad SA, Wen Q, Vizcay-Barrena G, Fleck RA, Zayats AV, Mannan SH.
Mansourian A, et al. Among authors: mannan sh.
Sci Rep. 2016 Feb 29;6:22272. doi: 10.1038/srep22272.
Sci Rep. 2016.
PMID: 26923553
Free PMC article.
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The effect of ultrasound on the gold plating of silica nanoparticles for use in composite solders.
Cobley AJ, Mason TJ, Alarjah M, Ashayer R, Mannan SH.
Cobley AJ, et al. Among authors: mannan sh.
Ultrason Sonochem. 2011 Jan;18(1):37-41. doi: 10.1016/j.ultsonch.2010.04.010. Epub 2010 May 12.
Ultrason Sonochem. 2011.
PMID: 20580892
Free article.
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