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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.
Micromachines (Basel). 2016 Oct 18;7(10):192. doi: 10.3390/mi7100192.
Micromachines (Basel). 2016.
PMID: 30404365
Free PMC article.
Decision support for subjects exposed to heat stress.
Seeberg TM, Vardøy AS, Taklo MM, Austad HO.
Seeberg TM, et al. Among authors: taklo mm.
IEEE J Biomed Health Inform. 2013 Mar;17(2):402-10. doi: 10.1109/JBHI.2013.2245141.
IEEE J Biomed Health Inform. 2013.
PMID: 24235112
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