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Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2018 | 1 |
2019 | 1 |
2020 | 1 |
2021 | 1 |
2022 | 1 |
2023 | 2 |
2024 | 0 |
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Ca-Doped Copper (I) Oxide Deposited via the Spray Coating Technique for Heterojunction Solar Cell Application.
Molecules. 2023 Oct 29;28(21):7324. doi: 10.3390/molecules28217324.
Molecules. 2023.
PMID: 37959745
Free PMC article.
The Influence of the ITO Layers' Thicknesses on Their Chosen Physical Surface Parameters.
Musztyfaga-Staszuk M, Gawlińska-Nęcek K, Socha R, Panek P.
Musztyfaga-Staszuk M, et al.
Materials (Basel). 2023 Feb 6;16(4):1363. doi: 10.3390/ma16041363.
Materials (Basel). 2023.
PMID: 36836993
Free PMC article.
Item in Clipboard
Investigation of Ti/Al2O3 + TiO2 and Ti + TiO2/Al2O3 + TiO2 hybrid coatings as protection of ultra-light Mg-(Li)-Al-RE alloys against corrosion.
Staszuk M, Pakuła D, Reimann Ł, Musztyfaga-Staszuk M, Socha R, Tański T.
Staszuk M, et al. Among authors: musztyfaga staszuk m.
Sci Rep. 2022 Nov 12;12(1):19363. doi: 10.1038/s41598-022-23452-x.
Sci Rep. 2022.
PMID: 36371415
Free PMC article.
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Comparison of the Values of Solar Cell Contact Resistivity Measured with the Transmission Line Method (TLM) and the Potential Difference (PD).
Musztyfaga-Staszuk M.
Musztyfaga-Staszuk M.
Materials (Basel). 2021 Sep 26;14(19):5590. doi: 10.3390/ma14195590.
Materials (Basel). 2021.
PMID: 34639986
Free PMC article.
Review.
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Copper Oxides on a Cu Sheet Substrate Made by Laser Technique.
Musztyfaga-Staszuk M, Janicki D, Gawlińska-Nęcek K, Socha R, Putynkowski G, Panek P.
Musztyfaga-Staszuk M, et al.
Materials (Basel). 2020 Aug 27;13(17):3794. doi: 10.3390/ma13173794.
Materials (Basel). 2020.
PMID: 32867399
Free PMC article.
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Correlation of Different Electrical Parameters of Solar Cells with Silver Front Electrodes.
Musztyfaga-Staszuk M, Janicki D, Panek P.
Musztyfaga-Staszuk M, et al.
Materials (Basel). 2019 Jan 24;12(3):366. doi: 10.3390/ma12030366.
Materials (Basel). 2019.
PMID: 30682819
Free PMC article.
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Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells.
Musztyfaga-Staszuk M, Putynkowski G, Socha R, Stodolny M, Panek P.
Musztyfaga-Staszuk M, et al.
Materials (Basel). 2018 Dec 7;11(12):2493. doi: 10.3390/ma11122493.
Materials (Basel). 2018.
PMID: 30544599
Free PMC article.
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