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Guan Z, Bi T, Li Q.Guan Z, et al. Among authors: li q.Skin Res Technol. 2023 Sep;29(9):e13459. doi: 10.1111/srt.13459.Skin Res Technol. 2023.PMID: 37753693Free PMC article.
Chen LX, Wang Y, Qin B, Gao XB, Li QF.Chen LX, et al.Skin Res Technol. 2021 Sep;27(5):993-996. doi: 10.1111/srt.13034. Epub 2021 Jul 6.Skin Res Technol. 2021.PMID: 34227710No abstract available.
Chen L, Wang Y, Gao X, Qin B, Lian J, Ren M, Zhang W, Wei R, Li Q.Chen L, et al. Among authors: li q.Skin Res Technol. 2022 Sep;28(5):703-707. doi: 10.1111/srt.13170. Epub 2022 Jun 21.Skin Res Technol. 2022.PMID: 35726961Free PMC article.
Chen L, Wang Y, Gao X, Qin B, Ren M, Zhang W, Wei R, Su H, Li Q.Chen L, et al. Among authors: li q.Skin Res Technol. 2023 Jan;29(1):e13234. doi: 10.1111/srt.13234. Epub 2022 Nov 15.Skin Res Technol. 2023.PMID: 36380494Free PMC article.
Chen L, Wang Y, Wang J, Qin B, Li Q.Chen L, et al. Among authors: li q.Skin Res Technol. 2023 Mar;29(3):e13304. doi: 10.1111/srt.13304.Skin Res Technol. 2023.PMID: 36973984Free PMC article.No abstract available.
Chen L, Wang Y, Zhang W, Su H, Li Q.Chen L, et al. Among authors: li q.Skin Res Technol. 2023 Apr;29(4):e13330. doi: 10.1111/srt.13330.Skin Res Technol. 2023.PMID: 37113081Free PMC article.
Chen L, Wang Y, Qin B, Fang H, Li Q.Chen L, et al. Among authors: li q.J Dermatol. 2023 Nov;50(11):1497-1500. doi: 10.1111/1346-8138.16884. Epub 2023 Aug 2.J Dermatol. 2023.PMID: 37533335
Chen L, Wang Y, Gao X, Li Q.Chen L, et al. Among authors: li q.Clin Exp Dermatol. 2024 Feb 14;49(3):259-262. doi: 10.1093/ced/llad354.Clin Exp Dermatol. 2024.PMID: 37846602
Wang Y, Chen L, Qin B, Li Q.Wang Y, et al. Among authors: li q.Skin Res Technol. 2023 Nov;29(11):e13523. doi: 10.1111/srt.13523.Skin Res Technol. 2023.PMID: 38009024Free PMC article.
Wang Y, Chen L, Fang H, Li Q.Wang Y, et al. Among authors: li q.Skin Res Technol. 2024 Jan;30(1):e13576. doi: 10.1111/srt.13576.Skin Res Technol. 2024.PMID: 38213040Free PMC article.No abstract available.