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Alloying conducting channels for reliable neuromorphic computing.
Yeon H, Lin P, Choi C, Tan SH, Park Y, Lee D, Lee J, Xu F, Gao B, Wu H, Qian H, Nie Y, Kim S, Kim J. Yeon H, et al. Among authors: lee d, lee j. Nat Nanotechnol. 2020 Jul;15(7):574-579. doi: 10.1038/s41565-020-0694-5. Epub 2020 Jun 8. Nat Nanotechnol. 2020. PMID: 32514010
Polarity governs atomic interaction through two-dimensional materials.
Kong W, Li H, Qiao K, Kim Y, Lee K, Nie Y, Lee D, Osadchy T, Molnar RJ, Gaskill DK, Myers-Ward RL, Daniels KM, Zhang Y, Sundram S, Yu Y, Bae SH, Rajan S, Shao-Horn Y, Cho K, Ougazzaden A, Grossman JC, Kim J. Kong W, et al. Among authors: lee d, lee k. Nat Mater. 2018 Nov;17(11):999-1004. doi: 10.1038/s41563-018-0176-4. Epub 2018 Oct 8. Nat Mater. 2018. PMID: 30297812
Long-term reliable physical health monitoring by sweat pore-inspired perforated electronic skins.
Yeon H, Lee H, Kim Y, Lee D, Lee Y, Lee JS, Shin J, Choi C, Kang JH, Suh JM, Kim H, Kum HS, Lee J, Kim D, Ko K, Ma BS, Lin P, Han S, Kim S, Bae SH, Kim TS, Park MC, Joo YC, Kim E, Han J, Kim J. Yeon H, et al. Among authors: lee d, lee y, lee js, lee h, lee j. Sci Adv. 2021 Jun 30;7(27):eabg8459. doi: 10.1126/sciadv.abg8459. Print 2021 Jun. Sci Adv. 2021. PMID: 34193431 Free PMC article.
Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors.
Kim Y, Suh JM, Shin J, Liu Y, Yeon H, Qiao K, Kum HS, Kim C, Lee HE, Choi C, Kim H, Lee D, Lee J, Kang JH, Park BI, Kang S, Kim J, Kim S, Perozek JA, Wang K, Park Y, Kishen K, Kong L, Palacios T, Park J, Park MC, Kim HJ, Lee YS, Lee K, Bae SH, Kong W, Han J, Kim J. Kim Y, et al. Among authors: lee d, lee k, lee j, lee ys, lee he. Science. 2022 Aug 19;377(6608):859-864. doi: 10.1126/science.abn7325. Epub 2022 Aug 18. Science. 2022. PMID: 35981034
Non-epitaxial single-crystal 2D material growth by geometric confinement.
Kim KS, Lee D, Chang CS, Seo S, Hu Y, Cha S, Kim H, Shin J, Lee JH, Lee S, Kim JS, Kim KH, Suh JM, Meng Y, Park BI, Lee JH, Park HS, Kum HS, Jo MH, Yeom GY, Cho K, Park JH, Bae SH, Kim J. Kim KS, et al. Among authors: lee d, lee jh, lee s. Nature. 2023 Feb;614(7946):88-94. doi: 10.1038/s41586-022-05524-0. Epub 2023 Jan 18. Nature. 2023. PMID: 36653458
Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions.
Kang JH, Shin H, Kim KS, Song MK, Lee D, Meng Y, Choi C, Suh JM, Kim BJ, Kim H, Hoang AT, Park BI, Zhou G, Sundaram S, Vuong P, Shin J, Choe J, Xu Z, Younas R, Kim JS, Han S, Lee S, Kim SO, Kang B, Seo S, Ahn H, Seo S, Reidy K, Park E, Mun S, Park MC, Lee S, Kim HJ, Kum HS, Lin P, Hinkle C, Ougazzaden A, Ahn JH, Kim J, Bae SH. Kang JH, et al. Among authors: lee d, lee s. Nat Mater. 2023 Dec;22(12):1470-1477. doi: 10.1038/s41563-023-01704-z. Epub 2023 Nov 27. Nat Mater. 2023. PMID: 38012388
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