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Lan Huong PT, Tu N, Lan H, Thang LH, Van Quy N, Tuan PA, Dinh NX, Phan VN, Le AT.Lan Huong PT, et al. Among authors: le at.RSC Adv. 2018 Apr 3;8(22):12376-12389. doi: 10.1039/c8ra00270c. eCollection 2018 Mar 26.RSC Adv. 2018.PMID: 35539375Free PMC article.
Pham TN, Van Hoang O, Van Manh T, Trang NLN, Oanh VTK, Lam VD, Phan VN, Le AT.Pham TN, et al. Among authors: le at.Anal Chim Acta. 2023 Aug 22;1270:341475. doi: 10.1016/j.aca.2023.341475. Epub 2023 Jun 3.Anal Chim Acta. 2023.PMID: 37311615
Nguyen DT, Mai TD, Dao PV, Ha HT, Le AT, Nguyen TTT, Vuong TX, Tran MC.Nguyen DT, et al. Among authors: le at.PLoS One. 2024 May 6;19(5):e0302822. doi: 10.1371/journal.pone.0302822. eCollection 2024.PLoS One. 2024.PMID: 38709783Free PMC article.
Phung TLH, Nguyen TA, Ngo XD, Vu NP, Le TL, Anh ND, Le AT.Phung TLH, et al. Among authors: le at.Chem Asian J. 2024 Apr 25:e202400166. doi: 10.1002/asia.202400166. Online ahead of print.Chem Asian J. 2024.PMID: 38664856
Tran TD, Le AT, Van Tran D, Le TQ, Pham TV.Tran TD, et al. Among authors: le at.Nat Prod Res. 2024 Apr 13:1-6. doi: 10.1080/14786419.2024.2341286. Online ahead of print.Nat Prod Res. 2024.PMID: 38613430
Hoang MH, Le DM, Le AT, Nguyen QK, Do TAT, Ho TG, Man MT.Hoang MH, et al. Among authors: le at.J Phys Condens Matter. 2024 Apr 15;36(28). doi: 10.1088/1361-648X/ad3ac4.J Phys Condens Matter. 2024.PMID: 38574677
Kwon SH, Ku KB, Le AT, Han GD, Park Y, Kim J, Tuan TT, Chung YS, Mansoor S.Kwon SH, et al. Among authors: le at.Sci Rep. 2024 Mar 26;14(1):7171. doi: 10.1038/s41598-024-57573-2.Sci Rep. 2024.PMID: 38532005Free PMC article.No abstract available.
Linh DT, Mai QD, Nguyet Nga DT, Anh NT, Van Tuan H, Nguyen HA, Vu XH, Le AT.Linh DT, et al. Among authors: le at.RSC Adv. 2024 Mar 25;14(14):9975-9984. doi: 10.1039/d4ra00048j. eCollection 2024 Mar 20.RSC Adv. 2024.PMID: 38528918Free PMC article.
Le AT, Ha HA, Al-Ansari MM, Elankathirselvan K, Al-Humaid LA.Le AT, et al.Environ Res. 2024 Mar 16;251(Pt 2):118729. doi: 10.1016/j.envres.2024.118729. Online ahead of print.Environ Res. 2024.PMID: 38492832