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Li F, Diao Y, Wang J, Hou X, Qiao S, Kong J, Sun Y, Lee ES, Jiang HB.Li F, et al. Among authors: kong j.Pain Res Manag. 2021 Dec 15;2021:3788660. doi: 10.1155/2021/3788660. eCollection 2021.Pain Res Manag. 2021.PMID: 34956432Free PMC article.Review.
Hou X, Xu X, Zhao M, Kong J, Wang M, Lee ES, Jia Q, Jiang HB.Hou X, et al. Among authors: kong j.J Esthet Restor Dent. 2022 Dec;34(8):1179-1196. doi: 10.1111/jerd.12955. Epub 2022 Aug 15.J Esthet Restor Dent. 2022.PMID: 35968802Review.
Marks M, Jeppesen H, Nielsen MLN, Kong J, Ceccato M, van der Veen MA, Bøjesen ED, Lock N.Marks M, et al. Among authors: kong j.Small. 2024 May 11:e2401413. doi: 10.1002/smll.202401413. Online ahead of print.Small. 2024.PMID: 38733238
Li X, Xue Q, Luan S, Luo K, Kong J, Meng X.Li X, et al. Among authors: kong j.Int J Mol Sci. 2024 May 2;25(9):4961. doi: 10.3390/ijms25094961.Int J Mol Sci. 2024.PMID: 38732180Free PMC article.
Kong J, Wei Y, Zhou F, Shi L, Zhao S, Wan M, Zhang X.Kong J, et al.Molecules. 2024 Apr 26;29(9):2002. doi: 10.3390/molecules29092002.Molecules. 2024.PMID: 38731492Review.
Liu Y, Kong J, Liu G, Li Z, Xiao Y.Liu Y, et al. Among authors: kong j.Adv Sci (Weinh). 2024 May 10:e2401797. doi: 10.1002/advs.202401797. Online ahead of print.Adv Sci (Weinh). 2024.PMID: 38728624Review.
Ma N, Zhang J, Kong J, Zhang X.Ma N, et al. Among authors: kong j.Anal Chem. 2024 May 10. doi: 10.1021/acs.analchem.4c00110. Online ahead of print.Anal Chem. 2024.PMID: 38728011
Wang S, Liu X, Chen H, Kong J, Guo Y, Lü W, Wang Z, Liu Z, Lü Z, Wang Z.Wang S, et al. Among authors: kong j.ACS Appl Mater Interfaces. 2024 May 10. doi: 10.1021/acsami.4c02760. Online ahead of print.ACS Appl Mater Interfaces. 2024.PMID: 38727094
Chi C, Cui H, Ding H, Kong J, Dong X.Chi C, et al. Among authors: kong j.J Chem Phys. 2024 May 14;160(18):184705. doi: 10.1063/5.0205445.J Chem Phys. 2024.PMID: 38726939