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Paradigms for restoration of somatosensory feedback via stimulation of the peripheral nervous system.
Clin Neurophysiol. 2018 Apr;129(4):851-862. doi: 10.1016/j.clinph.2017.12.027. Epub 2017 Dec 27.
Clin Neurophysiol. 2018.
PMID: 29343415
Review.
Bidirectional bionic limbs: a perspective bridging technology and physiology.
Pasluosta C, Kiele P, Čvančara P, Micera S, Aszmann OC, Stieglitz T.
Pasluosta C, et al. Among authors: kiele p.
J Neural Eng. 2022 Feb 8;19(1). doi: 10.1088/1741-2552/ac4bff.
J Neural Eng. 2022.
PMID: 35132954
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Reliability of Neural Implants-Effective Method for Cleaning and Surface Preparation of Ceramics.
Kiele P, Hergesell J, Bühler M, Boretius T, Suaning G, Stieglitz T.
Kiele P, et al.
Micromachines (Basel). 2021 Feb 19;12(2):209. doi: 10.3390/mi12020209.
Micromachines (Basel). 2021.
PMID: 33669493
Free PMC article.
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Neural Implants Without Electronics: A Proof-of-Concept Study on a Human Skin Model.
Kiele P, Braig D, Weis J, Baslan Y, Pasluosta C, Stieglitz T.
Kiele P, et al.
IEEE Open J Eng Med Biol. 2020 Mar 16;1:91-97. doi: 10.1109/OJEMB.2020.2981254. eCollection 2020.
IEEE Open J Eng Med Biol. 2020.
PMID: 35402961
Free PMC article.
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Design of Experiment Evaluation of a 2.5D Printing Process for Implantable PDMS-based Neural Interfaces.
Baslan Y, Stieglitz T, Kiele P.
Baslan Y, et al. Among authors: kiele p.
Annu Int Conf IEEE Eng Med Biol Soc. 2021 Nov;2021:6433-6436. doi: 10.1109/EMBC46164.2021.9629832.
Annu Int Conf IEEE Eng Med Biol Soc. 2021.
PMID: 34892584
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Design of experiment evaluation of sputtered thin film platinum surface metallization on alumina substrate for implantable conductive structures.
Kiele P, Cvancara P, Mueller M, Stieglitz T.
Kiele P, et al.
Annu Int Conf IEEE Eng Med Biol Soc. 2017 Jul;2017:1066-1069. doi: 10.1109/EMBC.2017.8037011.
Annu Int Conf IEEE Eng Med Biol Soc. 2017.
PMID: 29060058
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A polymer-metal two step sealing concept for hermetic neural implant packages.
Kohler F, Kiele P, Ordonez JS, Stieglitz T, Schuettler M.
Kohler F, et al. Among authors: kiele p.
Annu Int Conf IEEE Eng Med Biol Soc. 2014;2014:3981-4. doi: 10.1109/EMBC.2014.6944496.
Annu Int Conf IEEE Eng Med Biol Soc. 2014.
PMID: 25570864
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