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Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
Sensors (Basel). 2015 Dec 16;15(12):31821-32. doi: 10.3390/s151229885.
Sensors (Basel). 2015.
PMID: 26694407
Free PMC article.
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