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Feasibility Study of an Automated Assembly Process for Ultrathin Chips.
Micromachines (Basel). 2020 Jun 30;11(7):654. doi: 10.3390/mi11070654.
Micromachines (Basel). 2020.
PMID: 32629981
Free PMC article.
Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist.
Janek F, Eichhorn N, Weser S, Gläser K, Eberhardt W, Zimmermann A.
Janek F, et al.
Micromachines (Basel). 2021 Jul 21;12(8):856. doi: 10.3390/mi12080856.
Micromachines (Basel). 2021.
PMID: 34442478
Free PMC article.
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