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2019 | 1 |
2021 | 1 |
2024 | 0 |
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Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions.
Sci Rep. 2021 May 27;11(1):11109. doi: 10.1038/s41598-021-90634-4.
Sci Rep. 2021.
PMID: 34045611
Free PMC article.
Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method.
Takigawa R, Tomimatsu T, Higurashi E, Asano T.
Takigawa R, et al.
Micromachines (Basel). 2019 Feb 18;10(2):136. doi: 10.3390/mi10020136.
Micromachines (Basel). 2019.
PMID: 30781672
Free PMC article.
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