Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics.
Doshi SM, Barry A, Schneider A, Parambil N, Mulzer C, Yahyazadehfar M, Samadi-Dooki A, Foltz B, Warrington K, Wessel R, Zhang L, Simone C, Blackman GS, Lamontia MA, Gillespie JW Jr.
Doshi SM, et al. Among authors: gillespie jw jr.
ACS Appl Mater Interfaces. 2024 Jan 17;16(2):2692-2703. doi: 10.1021/acsami.3c14434. Epub 2024 Jan 3.
ACS Appl Mater Interfaces. 2024.
PMID: 38173339