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Wang Y, Zhao Y, Ying S, Du S, Gao Y.Wang Y, et al. Among authors: du s.IEEE Trans Cybern. 2022 Oct;52(10):10948-10956. doi: 10.1109/TCYB.2022.3157593. Epub 2022 Sep 19.IEEE Trans Cybern. 2022.PMID: 35316205
Yang Y, Fan D, Du S, Wang M, Chen B, Gao Y.Yang Y, et al. Among authors: du s.IEEE Trans Cybern. 2021 Mar;51(3):1678-1689. doi: 10.1109/TCYB.2019.2944171. Epub 2021 Feb 17.IEEE Trans Cybern. 2021.PMID: 31634854
Wang Y, Yan C, Feng Y, Du S, Dai Q, Gao Y.Wang Y, et al. Among authors: du s.IEEE Trans Pattern Anal Mach Intell. 2023 Jan;45(1):1135-1149. doi: 10.1109/TPAMI.2022.3148308. Epub 2022 Dec 5.IEEE Trans Pattern Anal Mach Intell. 2023.PMID: 35119998
Wan T, Du S, Cui W, Yao R, Ge Y, Li C, Gao Y, Zheng N.Wan T, et al. Among authors: du s.IEEE Trans Neural Netw Learn Syst. 2022 Aug;33(8):3547-3559. doi: 10.1109/TNNLS.2021.3053274. Epub 2022 Aug 3.IEEE Trans Neural Netw Learn Syst. 2022.PMID: 33556020
Gao Y, Zhang Z, Lin H, Zhao X, Du S, Zou C.Gao Y, et al. Among authors: du s.IEEE Trans Pattern Anal Mach Intell. 2022 May;44(5):2548-2566. doi: 10.1109/TPAMI.2020.3039374. Epub 2022 Apr 1.IEEE Trans Pattern Anal Mach Intell. 2022.PMID: 33211654
Li X, Bai Y, Peng Y, Du S, Ying S.Li X, et al. Among authors: du s.Int J Neural Syst. 2018 Mar;28(2):1750040. doi: 10.1142/S012906571750040X. Epub 2017 Sep 11.Int J Neural Syst. 2018.PMID: 28982281
Zhao X, Wang N, Zhang Y, Du S, Gao Y, Sun J.Zhao X, et al. Among authors: du s.IEEE Trans Neural Netw Learn Syst. 2018 Aug;29(8):3701-3714. doi: 10.1109/TNNLS.2017.2736640. Epub 2017 Aug 31.IEEE Trans Neural Netw Learn Syst. 2018.PMID: 28880193
Ying S, Li D, Xiao B, Peng Y, Du S, Xu M.Ying S, et al. Among authors: du s.PLoS One. 2017 Feb 23;12(2):e0172432. doi: 10.1371/journal.pone.0172432. eCollection 2017.PLoS One. 2017.PMID: 28231342Free PMC article.
Wang J, Zhang S, Liu Q, Du S, Guo YC, Zheng N, Wang FY.Wang J, et al. Among authors: du s.IEEE Trans Cybern. 2022 Oct;52(10):10458-10467. doi: 10.1109/TCYB.2021.3062842. Epub 2022 Sep 19.IEEE Trans Cybern. 2022.PMID: 33882011
Xing L, Chen B, Du S, Gu Y, Zheng N.Xing L, et al. Among authors: du s.IEEE Trans Cybern. 2021 Jun;51(6):3298-3311. doi: 10.1109/TCYB.2019.2952398. Epub 2021 May 18.IEEE Trans Cybern. 2021.PMID: 31794416