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The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives.
ACS Appl Mater Interfaces. 2024 Jan 10;16(1):1846-1860. doi: 10.1021/acsami.3c14900. Epub 2023 Dec 19.
ACS Appl Mater Interfaces. 2024.
PMID: 38113398
Free PMC article.
Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor.
Hamid Y, Hutt DA, Whalley DC, Craddock R.
Hamid Y, et al. Among authors: hutt da.
Sensors (Basel). 2020 Mar 19;20(6):1727. doi: 10.3390/s20061727.
Sensors (Basel). 2020.
PMID: 32204556
Free PMC article.
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Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation.
Graves JE, Sugden M, Litchfield RE, Hutt DA, Mason TJ, Cobley AJ.
Graves JE, et al. Among authors: hutt da.
Ultrason Sonochem. 2016 Mar;29:428-38. doi: 10.1016/j.ultsonch.2015.10.016. Epub 2015 Oct 24.
Ultrason Sonochem. 2016.
PMID: 26585024
Free article.
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