Crack propagation and fracture in silicon wafers under thermal stress.
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J Appl Crystallogr. 2013 Aug 1;46(Pt 4):849-855. doi: 10.1107/S0021889813003695. Epub 2013 Jun 7.
J Appl Crystallogr. 2013.
PMID: 24046487
Free PMC article.