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Xing L, Dai W, Zhang Y.Xing L, et al. Among authors: dai w.Sensors (Basel). 2022 May 27;22(11):4093. doi: 10.3390/s22114093.Sensors (Basel). 2022.PMID: 35684714Free PMC article.
Yi Z, Kuang C, Wang Y, Yu W, Cai C, Dai W.Yi Z, et al. Among authors: dai w.Sensors (Basel). 2018 Nov 23;18(12):4100. doi: 10.3390/s18124100.Sensors (Basel). 2018.PMID: 30477113Free PMC article.
Pan L, Li X, Yu W, Dai W, Kuang C, Chen J, Chen F, Xia P.Pan L, et al. Among authors: dai w.Sensors (Basel). 2020 Oct 23;20(21):6027. doi: 10.3390/s20216027.Sensors (Basel). 2020.PMID: 33114037Free PMC article.
Huang X, Dai W, Zhang Y, Xing L, Ye Y.Huang X, et al. Among authors: dai w.Sensors (Basel). 2023 Feb 8;23(4):1884. doi: 10.3390/s23041884.Sensors (Basel). 2023.PMID: 36850482Free PMC article.
Liu J, Dai W, Zhang Y, Xing L, Pan D.Liu J, et al. Among authors: dai w.Sensors (Basel). 2024 Mar 18;24(6):1930. doi: 10.3390/s24061930.Sensors (Basel). 2024.PMID: 38544193Free PMC article.
Xu Z, Cai C, Pan L, Dai W, He B.Xu Z, et al. Among authors: dai w.Sensors (Basel). 2024 Apr 5;24(7):2307. doi: 10.3390/s24072307.Sensors (Basel). 2024.PMID: 38610517Free PMC article.
Chen M, Wu T, Niu L, Ye T, Dai W, Zeng L, Kornyshev AA, Wang Z, Liu Z, Feng G.Chen M, et al. Among authors: dai w.Adv Mater. 2024 May 16:e2403202. doi: 10.1002/adma.202403202. Online ahead of print.Adv Mater. 2024.PMID: 38751336
Li D, Lin M, Zhang J, Qiu C, Chen H, Xiao Z, Shen J, Zheng Y, Long J, Dai W, Wang X, Fu X, Zhang Z.Li D, et al. Among authors: dai w.Small. 2024 May 15:e2402427. doi: 10.1002/smll.202402427. Online ahead of print.Small. 2024.PMID: 38751309
Diplock N, Baudin M, Xiang D, Liang LY, Dai W, Murphy JM, Lucet IS, Hassan JA, Lewis JD.Diplock N, et al. Among authors: dai w.Plant Physiol. 2024 May 15:kiae268. doi: 10.1093/plphys/kiae268. Online ahead of print.Plant Physiol. 2024.PMID: 38748589