Copper Wire Bonding: A Review.
Zhou H, Chang A, Fan J, Cao J, An B, Xia J, Yao J, Cui X, Zhang Y.
Zhou H, et al. Among authors: cao j.
Micromachines (Basel). 2023 Aug 16;14(8):1612. doi: 10.3390/mi14081612.
Micromachines (Basel). 2023.
PMID: 37630148
Free PMC article.
Review.