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Kim SW, Im GB, Jeong GJ, Baik S, Hyun J, Kim YJ, Pang C, Jang YC, Bhang SH.Kim SW, et al. Among authors: bhang sh.Biomaterials. 2021 Aug;275:120954. doi: 10.1016/j.biomaterials.2021.120954. Epub 2021 Jun 7.Biomaterials. 2021.PMID: 34130141
Bhang SH, Kim JH, Yang HS, La WG, Lee TJ, Sun AY, Kim GH, Lee M, Kim BS.Bhang SH, et al.Biomaterials. 2009 Oct;30(31):6247-56. doi: 10.1016/j.biomaterials.2009.07.058. Epub 2009 Aug 14.Biomaterials. 2009.PMID: 19682740
Bhang SH, Sun AY, Yang HS, Rhim T, Kim DI, Kim BS.Bhang SH, et al.Biotechnol Lett. 2011 Apr;33(4):845-51. doi: 10.1007/s10529-010-0492-5. Epub 2010 Dec 8.Biotechnol Lett. 2011.PMID: 21140191
Bhang SH, Cho SW, La WG, Lee TJ, Yang HS, Sun AY, Baek SH, Rhie JW, Kim BS.Bhang SH, et al.Biomaterials. 2011 Apr;32(11):2734-47. doi: 10.1016/j.biomaterials.2010.12.035. Epub 2011 Jan 22.Biomaterials. 2011.PMID: 21262528
Bhang SH, Park J, Yang HS, Shin J, Kim BS.Bhang SH, et al.Cell Transplant. 2013;22(3):437-45. doi: 10.3727/096368912X656162. Epub 2012 Oct 1.Cell Transplant. 2013.PMID: 23031161Free article.
La WG, Park S, Yoon HH, Jeong GJ, Lee TJ, Bhang SH, Han JY, Char K, Kim BS.La WG, et al. Among authors: bhang sh.Small. 2013 Dec 9;9(23):4051-60. doi: 10.1002/smll.201300571. Epub 2013 Jul 10.Small. 2013.PMID: 23839958
Lee TJ, Jang J, Kang S, Bhang SH, Jeong GJ, Shin H, Kim DW, Kim BS.Lee TJ, et al. Among authors: bhang sh.Tissue Eng Part A. 2014 Apr;20(7-8):1306-13. doi: 10.1089/ten.TEA.2013.0265. Epub 2013 Dec 18.Tissue Eng Part A. 2014.PMID: 24224833Free PMC article.
La WG, Jin M, Park S, Yoon HH, Jeong GJ, Bhang SH, Park H, Char K, Kim BS.La WG, et al. Among authors: bhang sh.Int J Nanomedicine. 2014 May 7;9 Suppl 1(Suppl 1):107-16. doi: 10.2147/IJN.S50742. eCollection 2014.Int J Nanomedicine. 2014.PMID: 24872706Free PMC article.
Lee TJ, Kang S, Jeong GJ, Yoon JK, Bhang SH, Oh J, Kim BS.Lee TJ, et al. Among authors: bhang sh.Tissue Eng Part A. 2015 Jan;21(1-2):374-81. doi: 10.1089/ten.TEA.2014.0015. Epub 2014 Sep 8.Tissue Eng Part A. 2015.PMID: 25065511Free PMC article.