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Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.
Micromachines (Basel). 2016 Oct 10;7(10):184. doi: 10.3390/mi7100184.
Micromachines (Basel). 2016.
PMID: 30404357
Free PMC article.
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