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balint medgyesi
(1 results)?
On the Electrochemical Migration Mechanism of Gold in Electronics-Less Reliable Than Expected?
Materials (Basel). 2021 Sep 12;14(18):5237. doi: 10.3390/ma14185237.
Materials (Basel). 2021.
PMID: 34576462
Free PMC article.
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.
Illés B, Hurtony T, Krammer O, Medgyes B, Dušek K, Bušek D.
Illés B, et al. Among authors: medgyes b.
Materials (Basel). 2019 Nov 3;12(21):3609. doi: 10.3390/ma12213609.
Materials (Basel). 2019.
PMID: 31684157
Free PMC article.
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