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Scalable Manufacturing of Nanogaps.
Adv Mater. 2018 Nov;30(46):e1801124. doi: 10.1002/adma.201801124. Epub 2018 Aug 29.
Adv Mater. 2018.
PMID: 30156331
Review.
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.
Bleiker SJ, Visser Taklo MM, Lietaer N, Vogl A, Bakke T, Niklaus F.
Bleiker SJ, et al.
Micromachines (Basel). 2016 Oct 18;7(10):192. doi: 10.3390/mi7100192.
Micromachines (Basel). 2016.
PMID: 30404365
Free PMC article.
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