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Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects.
Int J Mol Sci. 2022 Feb 8;23(3):1891. doi: 10.3390/ijms23031891.
Int J Mol Sci. 2022.
PMID: 35163817
Free PMC article.
The Effect of Ultrasonic Agitation on the Seedless Growth of Cu on Ru-W Thin Films.
Santos RF, Oliveira BMC, Ferreira PJ, Vieira MF.
Santos RF, et al.
Materials (Basel). 2022 Dec 24;16(1):167. doi: 10.3390/ma16010167.
Materials (Basel). 2022.
PMID: 36614506
Free PMC article.
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Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.
Oliveira BMC, Santos RF, Piedade AP, Ferreira PJ, Vieira MF.
Oliveira BMC, et al.
Nanomaterials (Basel). 2022 May 20;12(10):1752. doi: 10.3390/nano12101752.
Nanomaterials (Basel). 2022.
PMID: 35630972
Free PMC article.
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