Search Page
Save citations to file
Email citations
Send citations to clipboard
Add to Collections
Add to My Bibliography
Create a file for external citation management software
Your saved search
Your RSS Feed
Filters
Results by year
Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2019 | 1 |
2020 | 1 |
2021 | 1 |
2022 | 2 |
2023 | 1 |
2024 | 0 |
Search Results
6 results
Results by year
Filters applied: . Clear all
It looks like you are searching for an author.
Results are currently sorted by Best Match. To see the newest results first,
change the sort order to Most Recent.
Page 1
High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion Pumps.
Sensors (Basel). 2023 Jan 16;23(2):1040. doi: 10.3390/s23021040.
Sensors (Basel). 2023.
PMID: 36679836
Free PMC article.
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging.
Kariya S, Matsumae T, Kurashima Y, Takagi H, Hayase M, Higurashi E.
Kariya S, et al. Among authors: kurashima y.
Microsyst Nanoeng. 2022 Jan 17;8:2. doi: 10.1038/s41378-021-00339-x. eCollection 2022.
Microsyst Nanoeng. 2022.
PMID: 35087681
Free PMC article.
Item in Clipboard
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging.
Matsumae T, Kariya S, Kurashima Y, Thu LHH, Higurashi E, Hayase M, Takagi H.
Matsumae T, et al. Among authors: kurashima y.
Sensors (Basel). 2022 Oct 24;22(21):8144. doi: 10.3390/s22218144.
Sensors (Basel). 2022.
PMID: 36365842
Free PMC article.
Item in Clipboard
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions.
Matsumae T, Takigawa R, Kurashima Y, Takagi H, Higurashi E.
Matsumae T, et al. Among authors: kurashima y.
Sci Rep. 2021 May 27;11(1):11109. doi: 10.1038/s41598-021-90634-4.
Sci Rep. 2021.
PMID: 34045611
Free PMC article.
Item in Clipboard
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding.
Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Takamatsu S, Itoh T, Higurashi E.
Yamamoto M, et al. Among authors: kurashima y.
Micromachines (Basel). 2020 Apr 27;11(5):454. doi: 10.3390/mi11050454.
Micromachines (Basel). 2020.
PMID: 32349451
Free PMC article.
Item in Clipboard
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films.
Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Itoh T, Higurashi E.
Yamamoto M, et al. Among authors: kurashima y.
Micromachines (Basel). 2019 Feb 13;10(2):119. doi: 10.3390/mi10020119.
Micromachines (Basel). 2019.
PMID: 30781779
Free PMC article.
Item in Clipboard
Cite
Cite