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yi long cheng
(25 results)?
Reliability Characteristics of Metal-Insulator-Semiconductor Capacitors with Low-Dielectric-Constant Materials.
Molecules. 2023 Jan 23;28(3):1134. doi: 10.3390/molecules28031134.
Molecules. 2023.
PMID: 36770801
Free PMC article.
Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics.
Cheng YL, Wang KH, Lee CY, Chen GS, Fang JS.
Cheng YL, et al.
Materials (Basel). 2023 Feb 9;16(4):1452. doi: 10.3390/ma16041452.
Materials (Basel). 2023.
PMID: 36837082
Free PMC article.
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Chemical-Structure Evolution Model for the Self-Assembling of Amine-Terminated Monolayers on Nanoporous Carbon-Doped Organosilicate in Tightly Controlled Environments.
Fang JS, Yang TM, Pan YC, Lai GY, Cheng YL, Chen GS.
Fang JS, et al. Among authors: cheng yl.
Langmuir. 2020 Dec 15;36(49):15153-15161. doi: 10.1021/acs.langmuir.0c02801. Epub 2020 Dec 3.
Langmuir. 2020.
PMID: 33270454
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Electrical Characteristics and Reliability of Nitrogen-Stuffed Porous Low-k SiOCH/Mn2O3-xN/Cu Integration.
Cheng YL, Lin YL, Lee CY, Chen GS, Fang JS.
Cheng YL, et al.
Molecules. 2019 Oct 28;24(21):3882. doi: 10.3390/molecules24213882.
Molecules. 2019.
PMID: 31661909
Free PMC article.
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Effect of interfacial condition on electromigration for narrow and wide copper interconnects.
Cheng YL, Wang YL.
Cheng YL, et al.
J Nanosci Nanotechnol. 2008 May;8(5):2494-9. doi: 10.1166/jnn.2008.573.
J Nanosci Nanotechnol. 2008.
PMID: 18572672
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