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Year | Number of Results |
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2013 | 1 |
2020 | 2 |
2021 | 1 |
2024 | 0 |
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Page 1
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography.
Light Sci Appl. 2020 Apr 27;9:71. doi: 10.1038/s41377-020-0272-5. eCollection 2020.
Light Sci Appl. 2020.
PMID: 32351695
Free PMC article.
Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements.
Xu Y, Maier P, Blaicher M, Dietrich PI, Marin-Palomo P, Hartmann W, Bao Y, Peng H, Billah MR, Singer S, Troppenz U, Moehrle M, Randel S, Freude W, Koos C.
Xu Y, et al. Among authors: troppenz u.
Sci Rep. 2021 Aug 12;11(1):16426. doi: 10.1038/s41598-021-95981-w.
Sci Rep. 2021.
PMID: 34385575
Free PMC article.
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Photonic-integrated circuit for continuous-wave THz generation.
Theurer M, Göbel T, Stanze D, Troppenz U, Soares F, Grote N, Schell M.
Theurer M, et al. Among authors: troppenz u.
Opt Lett. 2013 Oct 1;38(19):3724-6. doi: 10.1364/OL.38.003724.
Opt Lett. 2013.
PMID: 24081036
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3D-printed optical probes for wafer-level testing of photonic integrated circuits.
Trappen M, Blaicher M, Dietrich PI, Dankwart C, Xu Y, Hoose T, Billah MR, Abbasi A, Baets R, Troppenz U, Theurer M, Wörhoff K, Seyfried M, Freude W, Koos C.
Trappen M, et al. Among authors: troppenz u.
Opt Express. 2020 Dec 7;28(25):37996-38007. doi: 10.1364/OE.405139.
Opt Express. 2020.
PMID: 33379622
Free article.
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