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2020 | 1 |
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Review of microstructure and properties of low temperature lead-free solder in electronic packaging.
Sci Technol Adv Mater. 2020 Oct 19;21(1):689-711. doi: 10.1080/14686996.2020.1824255.
Sci Technol Adv Mater. 2020.
PMID: 33177953
Free PMC article.
Review.
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.
Yang F, Zhang L, Liu ZQ, Zhong SJ, Ma J, Bao L.
Yang F, et al. Among authors: zhong sj.
Materials (Basel). 2017 May 19;10(5):558. doi: 10.3390/ma10050558.
Materials (Basel). 2017.
PMID: 28772917
Free PMC article.
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Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.
Zhang L, Liu ZQ, Yang F, Zhong SJ.
Zhang L, et al. Among authors: zhong sj.
Materials (Basel). 2017 Mar 23;10(4):327. doi: 10.3390/ma10040327.
Materials (Basel). 2017.
PMID: 28772686
Free PMC article.
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