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Page 1
Efficient Fabrication of Organic Electrochemical Transistors via Wet Chemical Processing.
ACS Appl Mater Interfaces. 2022 Mar 16;14(10):12469-12478. doi: 10.1021/acsami.1c23626. Epub 2022 Mar 1.
ACS Appl Mater Interfaces. 2022.
PMID: 35230814
Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.
Biswas S, Mozafari M, Stauden T, Jacobs HO.
Biswas S, et al.
Micromachines (Basel). 2016 Mar 28;7(4):54. doi: 10.3390/mi7040054.
Micromachines (Basel). 2016.
PMID: 30407427
Free PMC article.
Review.
Item in Clipboard
Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.
Biswas S, Schoeberl A, Hao Y, Reiprich J, Stauden T, Pezoldt J, Jacobs HO.
Biswas S, et al.
Nat Commun. 2019 Oct 28;10(1):4909. doi: 10.1038/s41467-019-12870-7.
Nat Commun. 2019.
PMID: 31659160
Free PMC article.
Item in Clipboard
A first implementation of an automated reel-to-reel fluidic self-assembly machine.
Park SC, Fang J, Biswas S, Mozafari M, Stauden T, Jacobs HO.
Park SC, et al. Among authors: biswas s.
Adv Mater. 2014 Sep 10;26(34):5942-9. doi: 10.1002/adma.201401573. Epub 2014 Jun 27.
Adv Mater. 2014.
PMID: 24975472
Free PMC article.
Item in Clipboard
Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination.
Park SC, Biswas S, Fang J, Mozafari M, Stauden T, Jacobs HO.
Park SC, et al. Among authors: biswas s.
Adv Mater. 2015 Jun 24;27(24):3661-8. doi: 10.1002/adma.201500839. Epub 2015 May 12.
Adv Mater. 2015.
PMID: 25966304
Free PMC article.
Item in Clipboard
Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points.
Kaltwasser M, Schmidt U, Lösing L, Biswas S, Stauden T, Bund A, Jacobs HO.
Kaltwasser M, et al. Among authors: biswas s.
Sci Rep. 2019 Aug 5;9(1):11325. doi: 10.1038/s41598-019-47690-8.
Sci Rep. 2019.
PMID: 31383873
Free PMC article.
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Core-Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects.
Kaltwasser M, Schmidt U, Biswas S, Reiprich J, Schlag L, Isaac NA, Stauden T, Jacobs HO.
Kaltwasser M, et al. Among authors: biswas s.
ACS Appl Mater Interfaces. 2018 Nov 28;10(47):40608-40613. doi: 10.1021/acsami.8b12390. Epub 2018 Nov 15.
ACS Appl Mater Interfaces. 2018.
PMID: 30433752
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