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Page 1
Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor.
Sensors (Basel). 2020 Mar 19;20(6):1727. doi: 10.3390/s20061727.
Sensors (Basel). 2020.
PMID: 32204556
Free PMC article.
Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures.
Ren J, Ward M, Kinnell P, Craddock R, Wei X.
Ren J, et al. Among authors: craddock r.
Sensors (Basel). 2016 Feb 5;16(2):204. doi: 10.3390/s16020204.
Sensors (Basel). 2016.
PMID: 26861332
Free PMC article.
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