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matej pasek
(1 results)?
Microstructure and Corrosion Behavior of Sn-Zn Alloys.
Materials (Basel). 2022 Oct 16;15(20):7210. doi: 10.3390/ma15207210.
Materials (Basel). 2022.
PMID: 36295278
Free PMC article.
Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type Solder.
Kolenak R, Melus T, Drapala J, Gogola P, Pasak M.
Kolenak R, et al. Among authors: pasak m.
Materials (Basel). 2023 Apr 10;16(8):2991. doi: 10.3390/ma16082991.
Materials (Basel). 2023.
PMID: 37109827
Free PMC article.
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Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
Kolenak R, Kostolny I, Drapala J, Babincova P, Pasak M.
Kolenak R, et al. Among authors: pasak m.
Materials (Basel). 2021 Oct 25;14(21):6369. doi: 10.3390/ma14216369.
Materials (Basel). 2021.
PMID: 34771894
Free PMC article.
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Experimental and Numerical Analysis of High-Temperature Superconducting Tapes Modified by Composite Thermal Stabilization Subjected to Thermomechanical Loading.
Cuninková E, Pekarčíková M, Skarba M, Krajčovič J, Pašák M.
Cuninková E, et al. Among authors: pasak m.
Materials (Basel). 2021 Jun 26;14(13):3579. doi: 10.3390/ma14133579.
Materials (Basel). 2021.
PMID: 34206884
Free PMC article.
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Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite.
Kolenak R, Pluhar A, Drapala J, Babincova P, Pasak M.
Kolenak R, et al. Among authors: pasak m.
Materials (Basel). 2023 May 17;16(10):3795. doi: 10.3390/ma16103795.
Materials (Basel). 2023.
PMID: 37241421
Free PMC article.
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