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Page 1
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
Micromachines (Basel). 2019 May 23;10(5):342. doi: 10.3390/mi10050342.
Micromachines (Basel). 2019.
PMID: 31126083
Free PMC article.
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker KF, Rzepka S, Schneider-Ramelow M.
Roshanghias A, et al. Among authors: dreissigacker m.
Micromachines (Basel). 2020 May 31;11(6):564. doi: 10.3390/mi11060564.
Micromachines (Basel). 2020.
PMID: 32486457
Free PMC article.
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