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Decision support for subjects exposed to heat stress.
IEEE J Biomed Health Inform. 2013 Mar;17(2):402-10. doi: 10.1109/JBHI.2013.2245141.
IEEE J Biomed Health Inform. 2013.
PMID: 24235112
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.
Bleiker SJ, Visser Taklo MM, Lietaer N, Vogl A, Bakke T, Niklaus F.
Bleiker SJ, et al. Among authors: visser taklo mm.
Micromachines (Basel). 2016 Oct 18;7(10):192. doi: 10.3390/mi7100192.
Micromachines (Basel). 2016.
PMID: 30404365
Free PMC article.
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