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Year | Number of Results |
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2009 | 1 |
2021 | 2 |
2022 | 1 |
2023 | 1 |
2024 | 0 |
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Page 1
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging.
Materials (Basel). 2021 Sep 16;14(18):5342. doi: 10.3390/ma14185342.
Materials (Basel). 2021.
PMID: 34576571
Free PMC article.
Review.
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging.
Wang PH, Huang YW, Chiang KN.
Wang PH, et al. Among authors: chiang kn.
Micromachines (Basel). 2021 Mar 10;12(3):295. doi: 10.3390/mi12030295.
Micromachines (Basel). 2021.
PMID: 33802243
Free PMC article.
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Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms.
Su QH, Chiang KN.
Su QH, et al. Among authors: chiang kn.
Materials (Basel). 2022 May 30;15(11):3897. doi: 10.3390/ma15113897.
Materials (Basel). 2022.
PMID: 35683193
Free PMC article.
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Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.
Yuan C, Su Q, Chiang KN.
Yuan C, et al. Among authors: chiang kn.
Materials (Basel). 2023 Jul 10;16(14):4922. doi: 10.3390/ma16144922.
Materials (Basel). 2023.
PMID: 37512197
Free PMC article.
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Determining the zero-force binding energetics of an intercalated DNA complex by a single-molecule approach.
Yang TS, Cui Y, Wu CM, Lo JM, Chiang CS, Shu WY, Chung WJ, Yu CS, Chiang KN, Hsu IC.
Yang TS, et al. Among authors: chiang kn.
Chemphyschem. 2009 Nov 9;10(16):2791-4. doi: 10.1002/cphc.200900435.
Chemphyschem. 2009.
PMID: 19795434
No abstract available.
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